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Showing 1 - 25 of 26 Results
1.
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Reliability of RoHS-Compliant 2D and 3D IC Interconnects by Lau, John H. ISBN: 9780071753791
$67.27
2.
Electronics Manufacturing With Lead-Free, Haogen Free, and Conductive Adhesive Materials
Electronics Manufacturing With Lead-Free, Haogen Free, and Conductive Adhesive Materials by Lau, John H., Wong, C. P., ... ISBN: 9780071386241 List Price: $125.00

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3.
Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging by Lau, John H. ISBN: 9780442010584 List Price: $99.95
$99.11
4.
Electronic Packaging Design, Materials, Process, and Reliability
Electronic Packaging Design, Materials, Process, and Reliability by Lau, John H., Nakayama, Wat... ISBN: 9780070371354 List Price: $69.00
$91.28
5.
Chip Scale Packaging Design, Materials, Processes and Realiablity, and Applications
Chip Scale Packaging Design, Materials, Processes and Realiablity, and Applications by Lau, John H., Lee, S. W. Ricky ISBN: 9780070383043 List Price: $89.50

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6.
Solder Joint Reliability of Bga, Csp, Flip Chip, and Fine Pitch Smt Assemblies
Solder Joint Reliability of Bga, Csp, Flip Chip, and Fine Pitch Smt Assemblies by Lau, John H., Pao, Yi-Hsin ISBN: 9780070366480 List Price: $65.00
$31.03 (Save 52%)
7.
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging by Lau, John H. ISBN: 9789811088834 List Price: $199.99
$73.64 (Save 63%)
8.
Ball Grid Array Technology
Ball Grid Array Technology by Lau, John H. ISBN: 9780070366084 List Price: $85.00
$18.55 (Save 78%)
9.
Flip Chip Technologies
Flip Chip Technologies by Lau, John H. ISBN: 9780070366091 List Price: $89.00
$2.99 (Save 96%)
10.
Handbook of Tape Automated Bonding
Handbook of Tape Automated Bonding by Lau, John H. ISBN: 9780442004279 List Price: $299.00
$78.15 (Save 73%)
11.
Low Cost Flip Chip Technologies For Dca, Wlcsp, and Pbga Assemblies
Low Cost Flip Chip Technologies For Dca, Wlcsp, and Pbga Assemblies by Lau, John H. ISBN: 9780071351416 List Price: $89.95
$30.73 (Save 65%)
12.
Microvias Low Cost, High Density Interconnects
Microvias Low Cost, High Density Interconnects by Lau, John H., Lee, Ricky S. W. ISBN: 9780071363273 List Price: $99.95
$59.66 (Save 40%)
13.
Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)
Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering) by John H. Lau ISBN: 9780442012588 List Price: $212.50
$58.34 (Save 72%)
14.
Second Skin : The Screenplay
Second Skin : The Screenplay by Lau, John H. ISBN: 9781593001124 List Price: $19.95

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15.
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints by Lau, John H., Lee, Ning-Cheng ISBN: 9789811539190 List Price: $179.99

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16.
Heterogeneous Integrations
Heterogeneous Integrations by Lau, John H. ISBN: 9789811372261 List Price: $119.99

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17.
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints by Lau, John H., Lee, Ning-Cheng ISBN: 9789811539220
$119.25
18.
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging by Lau, John H. ISBN: 9789811613753
$142.62 $71.79
19.
Heterogeneous Integrations
Heterogeneous Integrations by Lau, John H. ISBN: 9789811372230 List Price: $159.99
$155.49 (Save 2%)
20.
Solder Joint Reliability : Theory and Applications
Solder Joint Reliability : Theory and Applications by Lau, John H. ISBN: 9781461367437 List Price: $378.00
$200.78 (Save 46%)
21.
Solder Joint Reliability
Solder Joint Reliability by Lau, John H. ISBN: 9781461539117 List Price: $24.99

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22.
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging by Lau, John H. ISBN: 9789811342660 List Price: $139.99

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23.
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging by Lau, John H. ISBN: 9789811999161 List Price: $199.99

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24.
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging by Lau, John H. ISBN: 9789811613784 List Price: $139.99
$112.41 (Save 19%)
25.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by Lau, John H. ISBN: 9789819721399 List Price: $199.99
$144.81 (Save 27%)
Showing 1 - 25 of 26 Results - Browse more Lau John H. in all departments
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