496749

9780070383043

Chip Scale Packaging Design, Materials, Processes and Realiablity, and Applications

Chip Scale Packaging Design, Materials, Processes and Realiablity, and Applications
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  • ISBN-13: 9780070383043
  • ISBN: 0070383049
  • Publisher: McGraw-Hill Professional Publishing

AUTHOR

Lau, John H., Lee, S. W. Ricky

SUMMARY

Lau, John H. is the author of 'Chip Scale Packaging Design, Materials, Processes and Realiablity, and Applications' with ISBN 9780070383043 and ISBN 0070383049.

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