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Introduction to Microsystem Packaging Technology
by Jin, Yufeng, Wang, Zhiping,...
ISBN: 9781439819104
List Price: $129.95
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Device-To-Device-based Proximity Service : Architecture, Issues, and Applications
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ISBN: 9781498724173
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TSV 3D RF Integration : High Resistivity Si Interposer Technology
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ISBN: 9780323996020
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Introduction to Microsystem Packaging Technology
by Jin, Yufeng, Wang, Zhiping,...
ISBN: 9781138374256
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Higher Vocational Education Teaching Research
by Chu, YuFeng, Jin, ChaoKun
ISBN: 9798888824535
List Price: $6.99
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