Thermo-Mechanische Und Mikrostrukturelle Charakterisierung Von Kupfer-Durchkontaktierungen Im Silizium (Through Silicon Vias) (German Edition)

Name: Thermo-Mechanische Und Mikrostrukturelle Charakterisierung Von Kupfer-Durchkontaktierungen Im Silizium (Through Silicon Vias) (German Edition)
Price: 70.03 USD
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Author: Peter Sattler
ISBN: 9783668211384

by Peter Sattler

Thermo-Mechanische Und Mikrostrukturelle Charakterisierung Von Kupfer-Durchkontaktierungen Im Silizium (Through Silicon Vias) (German Edition)

by Peter Sattler

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ISBN-13: 9783668211384
ISBN: 3668211388
Publication Date: 2016
Publisher: Grin Publishing

AUTHOR

Peter Sattler

SUMMARY

Peter Sattler is the author of 'Thermo-Mechanische Und Mikrostrukturelle Charakterisierung Von Kupfer-Durchkontaktierungen Im Silizium (Through Silicon Vias) (German Edition)', published 2016 under ISBN 9783668211384 and ISBN 3668211388.

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