82696867

9786139858248

Stress Induced Voiding & Electromigration Analysis of Cu-cu Bonds

Stress Induced Voiding & Electromigration Analysis of Cu-cu Bonds
$92.36
$3.95 Shipping
  • Condition: Good
  • Provider: Bonita
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  • Shipping: Standard
  • Comments: Access codes and supplements are not guaranteed with used items. May be an ex-library book.

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  • ISBN-13: 9786139858248
  • ISBN: 6139858240
  • Publisher: Lap Lambert Academic Publishing

AUTHOR

Singh, Harjinder, Sappal, Amandeep Singh, Sharma, Manvinder

SUMMARY

Singh is the author of 'Stress Induced Voiding & Electromigration Analysis of Cu-cu Bonds' with ISBN 9786139858248 and ISBN 6139858240.

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