5322931
9780387388908
Solder joints are ubiquitous in electronic consumer products. In this book, the advancedmaterials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.Tu, King-Ning is the author of 'Solder Joint Technology Materials, Properties, and Reliability', published 2007 under ISBN 9780387388908 and ISBN 0387388907.
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