1490065
9780750672184
Focused on technological innovations in the field of electronics packaging and production, this book explains the changes in reflow soldering processes and troubleshooting difficulties encountered during these processes in a variety of board types.Ning-Cheng Lee PhD is the author of 'Reflow Soldering Processes', published 2002 under ISBN 9780750672184 and ISBN 0750672188.
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