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9783540223696
Integrating Modeling Of Chemical Mechanical Planarization For Sub-Micron IC Fabrication From Particle Scale To Feature, Die And Wafer Scales
by Dornfeld, David, Luo, Jianfeng
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Product details
- ISBN-13: 9783540223696
- ISBN: 354022369X
- Publication Date: 2004
- Publisher: Springer
AUTHOR
SUMMARY
This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP.Dornfeld, David is the author of 'Integrating Modeling Of Chemical Mechanical Planarization For Sub-Micron IC Fabrication From Particle Scale To Feature, Die And Wafer Scales', published 2004 under ISBN 9783540223696 and ISBN 354022369X.
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