5214160
9780387281537
This work reviews the various integrated circuit packaging, assembly and interconnection technologies, providing an overview of the materials, processes, trends and available options that encompass electronic manufacturing. It covers both technical issues and reliability concerns.Greig, William J. is the author of 'Integrated Circuit Packaging, Assembly And Interconnections ', published 2007 under ISBN 9780387281537 and ISBN 0387281533.
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