883955

9783540667728

Handbook of Advanced Plasma Processing Techniques

Handbook of Advanced Plasma Processing Techniques
$281.95
$3.95 Shipping
List Price
$289.00
Discount
2% Off
You Save
$7.05

  • Condition: New
  • Provider: gridfreed Contact
  • Provider Rating:
    66%
  • Ships From: San Diego, CA
  • Shipping: Standard
  • Comments: New. In shrink wrap. Looks like an interesting title!

seal  

Ask the provider about this item.

Most renters respond to questions in 48 hours or less.
The response will be emailed to you.
Cancel
  • ISBN-13: 9783540667728
  • ISBN: 3540667725
  • Publisher: Springer

AUTHOR

Shul, R. J., Pearton, S. J.

SUMMARY

This volume covers the topic of advanced plasma processing techniques, from the fundamental physics of plasmas to diagnostics, modeling and applications such as etching and deposition for microelectronics. The use of plasmas for patterning on a submicron scale has enabled successive generations of continually smaller transistors, lasers, micromachines, sensors and magnetic read/write heads that have formed the basis of our information age. This volume is the first to give coverage to this broad area of topics in a detailed fashion, especially in the rapidly expanding fields of micro-mechanical machines, photomask fabrication, magnetic data storage and reactor modeling. It provides the reader with a broad array of topics, authored by the leading experts in the field.Shul, R. J. is the author of 'Handbook of Advanced Plasma Processing Techniques' with ISBN 9783540667728 and ISBN 3540667725.

[read more]

Questions about purchases?

You can find lots of answers to common customer questions in our FAQs

View a detailed breakdown of our shipping prices

Learn about our return policy

Still need help? Feel free to contact us

View college textbooks by subject
and top textbooks for college

The ValoreBooks Guarantee

The ValoreBooks Guarantee

With our dedicated customer support team, you can rest easy knowing that we're doing everything we can to save you time, money, and stress.