1960679
9783540221876
Aimed at practitioners in the field, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests.Schwizer, Jürg is the author of 'Force Sensors For Microelectronic Packaging Applications', published 2004 under ISBN 9783540221876 and ISBN 3540221875.
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