Electronic Packaging And Interconnection Handbook

Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies.Harper, Charles A. is the author of 'Electronic Packaging And Interconnection Handbook', published 2004 under ISBN 9780071430487 and ISBN 0071430482.