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9780750692670
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.Moore, Thomas M. is the author of 'CHAR INTEGRATED CIRCUIT PACKAGING MAT'L - Thomas M. Moore - Hardcover' with ISBN 9780750692670 and ISBN 0750692677.
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