71966966

9783030982317

3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization

3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization
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  • ISBN-13: 9783030982317
  • ISBN: 3030982319
  • Publication Date: 2023
  • Publisher: Springer International Publishing AG

AUTHOR

Bamberg, Lennart, Joseph, Jan Moritz, Garc�a-Ortiz, Alberto

SUMMARY

Bamberg, Lennart is the author of '3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization', published 2023 under ISBN 9783030982317 and ISBN 3030982319.

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